Securing Chiplet-Based Semiconductor Manufacturing from Untrusted Supply Chains
Securing Chiplet-Based Semiconductor Manufacturing from Untrusted Supply Chains
Project Summary
The rise of chiplet-based semiconductor design — where heterogeneous dies from potentially different foundries are integrated into a single package — introduces new supply chain security risks. This project investigates hardware security primitives and verification techniques for chiplet-based systems manufactured through untrusted supply chains.
Research focus areas:
- Chiplet authentication: Hardware-based identity and integrity verification for individual chiplets prior to integration
- Malicious implant detection: Techniques for identifying hardware Trojans or unauthorized modifications introduced during fabrication or assembly
- Secure inter-chiplet communication: Ensuring confidentiality and integrity of data exchanged across die-to-die interconnects
Funding
This project is supported by the Virginia Innovation Partnership Authority (Award #N3Q24003).